Wafer Slicing Service

Since the very beginning of Swiss Wafers AG in January 2004, we are slicing silicon ingots into wafers for photovoltaic application using the latest wire saw technology. We execute this operation on wire saws from the two world market leaders HCT and Meyer + Burger, both Swiss companies.

Swiss Wafers’ CEO and chief of technology both have many years of experience in wire sawing.
  

We offer the service of slicing the customer's ingots into wafers.

Square or pseudosquare ingots of any common size up to 156 mm x 156 mm will be converted into wafers of high quality with good yield.

Interesting possibilities arise from the combination of wafer slicing with our Bricketing Service, Squaring Service and/or Ingot Growing Service – in summary:

If you need wafers (mono or multi) and you have any silicon materials that can be used for it (raw materials, scrap materials, round or pseudosquare ingots) – just contact us.