News

September 2011

Welcome to our booth no. B5/B2 at the 26th PVSEC in Hamburg, Germany (05.09.11 - 08.09.11)

June 2011

Welcome to our booth A5/143 at the Intersolar in Munich, Germany (08.06. – 10.06.2011)

June 2011

There have been made modernisations of the existing slurry recycling machines and it was implemented an additional slurry recycling machine from AMAT.

April 2011

Production volumes have been increased up to 200 MW by implementing new wire saw machines and by modernizating the existing casting furnaces.

March 2011

Swiss Wafers implemented the second polishing machine for grinding bricks/ingots. Roughness of surface is less 0.4 mkm

September 2010

Welcome to our booth no. L3/H1/C5 at the 25th PVSEC in Valencia, Spain. (06.09.10 - 10.09.10)

June 2010  

Welcome to our booth no. B3/340 at the Intersolar 2010 in Munich (09.06.10 – 11.06.10)

March 2010
Swiss Wafers upgraded squaring machine and uses this machine for precisie top/tail cutting. This increases the capacity and Swiss Wafers is able to make OEM operations for production of bricks/ingots.

January 2010

Swiss Wafers starts polishing grinding bricks/ingots. Roughness of surface is less 0.4 mkm.

September 2009

Welcome to PVSEC Exhibition. Please check our booth number, our location there.

May 2009 

Welcome to InterSolar 2009 Exhibition in Munich. Please check our booth number, our location there.

(27.05.09 - 29.05.09)

January 2009

Swiss Wafers AG has finished installation of 17 furnaces for multi-silicon crystals, what allows to produce until 85 tons of silicon crystals per months (140-150 MWp/Y)

The building and the infrastructure allow the installation of additional 15 furnaces for multi-silicon crystals (Total capacity up to 300 MWp/Year)

Swiss Wafers knows the technology of producing three types of crystals with each in-load:

400-540 kg ; 240-370 kg ; 5-20 kg

December 2008

Swiss Wafers AG has installed a non-cassette wafer cleaning line and a sorting machine which controls the following wafer parameters: Size, Resistivity, Saw Marks, TTV, TV, Edge Defects, Chips, Cracks, Micro Cracks (Non Visual Crack Detection)

Capacity both 2 Ultrasonic Clean Line is 3`500`000 wafers/month (150 MWp/Y)

June 2008  

Welcome to InterSolar2008, booth 111 ; hall B5

June 2008

Start installations new wire saw machines.

May 2008

Meeting with the councilor´s president, (Canton Thurgau) Dr. Kaspar Schlaepfer and the mayor of the city Weinfelden, Mr. Vögele.

High-ranking government representatives of the canton of Thurgau have visited the company Swiss Wafers and have promised the full support from the public institutions for the expansion of the company Swiss Wafers. The planned purchase of land of 24 ' 000 square meters for the establishment of the factory of Swiss Wafers 2 was favoured.

May 2008

Start of installation new 10 furnaces with charges more 420 kg.

April 2008

New central cooling systems  3 MWt for all  20 custing machines.

March 2008

All Swiss Wafer´s buildings are completed

January 2008

Participation in an exhibition in China:

Welcome to our Booth G 21

December 2007

New Clean Line

Details for May 2008 installation of the completely automated cleaning, control, and sorting of mono and multisilicon wafers line for 140 – 220 micro thicknesses are finalized. Capacity of the new line is 90 Mwp/year.

Technological news:

The purpose of researches - to have the charge of raw material less than 6,0 gr  polysilicon / Wp.

In the future (2009) we expect less 5,0 gr polysilicon /Wp:

• Thin wafers

• Thin wire

• Complete automation ungluing and pre cleaning ingots and cleaning, control and packing wafers.

• New ingots geometry and charge 450-520 kg.

Thin wire:

Work on the development slicing wafers  technology with use  thinner thickness wire (less than 15%) is successfully completed. The technology allows a yield increase of wafers from 1 kg of raw material.

Clean cast side wall:

 Work on development of new principle technology of cleaning  cast side walls and tops and tails post growth process  is successfully completed. This technology will increase a yield of wafers from 1 kg of raw material.

December 2007

600 MWp by 2010

The agreement on expansion of industrial building on 6000 sq.m is finalized. The new building and appropriate infrastructure will allow additional space for 400 Mwp equipment. This will create conditions for achieving total company productivity to 600 MWp/Year by 2010.

November 2007

Furnaces:

The contracts on delivery in addition 20 furnaces with loading up to 450 kg with the company GT Solar are made. The productivity of the company on the Growing equipment will reach 180 MWp/Year.

Wire saw machines:

A contract for eight additional wire saw machines and three squarers from HCT company is made. Productivity will reach 180 Mwp/Year.

Exhibition in Taiwan

October 2007

Swiss Wafers has signed a contract with the company Wacker (Germany) on

delivery of polysilicon from 2010 until 2019.

September 2007

Swiss wafers is participation at 22nd European Photovoltaic Solar Energy Exhibition in Milan,  Hall 16 booth B18.

July 2007

Construction new three-floor office building Swiss wafers AG in Weinfelden is finished.

New office building

June 2007

Contracts are signed with some buyers for delivery of Wafers in volume to 300 million USD, including

Motech in volume 200 million USD for 4 years.

Dr.S.Tsuo, CEO Motech  and Dr.A.Lebedev, CEO Swiss wafers

Press release Motech:

Motech Signs Wafer Supply Agreement with Swiss Wafer AG.

Date of occurrence of the event: 2007/06/13 Counterparty to the contract: Swiss Wafer AG.Starting and ending dates  of the contract: 2007/10/01-2011/12/31. Major content: Swiss Wafer AG will supply Motech with wafers equivalent to NT$ 3.7 billion (USD 114 million) over the contract period. Effect on company finances and business : Secure wafer supply for production needs.
  

Motech Signs Follow-on Wafer Supply Agreement with Swiss Wafer AG.

Date of occurrence of the event: 2007/06/15 Counterparty to the contract: Swiss Wafer AG.Starting and ending dates  of the contract: 2007/10/01-2011/12/31. Major content: Swiss Wafer AG will supply Motech with wafers equivalent to NT$ 2.8 billion (USD 85 million) over the contract period.Effect on company finances and business : Secure wafer supply for production needs.
 

June 2007

Swiss Wafers has taken booth at Intersolar exhibitions 2007 in Freiburg, booth 4-312.

Big blocks multi-silicon ingots with big length 310 mm (size 156x156x310 mm)  with polished sides have been shown for the first time in exhibition.

Booth Swiss wafers in InterSolar 2007.

June 2007

New technologies: productivity of the furnace of growing is increased up to 340 kg from process, an output of production from the furnace up to 3200 kg/months . Lengths of block increase to 31 cm.

New long and standart blocks from multi-ingots.

Mai 2007

Swiss Wafers AG  has finished construction of a building for 30 furnaces casting (up to 1250 tons of raw material year or 150-180 MWp/Year of crystals) and has finished installation 7 furnaces for multi-silicon crystals.

 Capacities of the electric power is led to building on 7 MegaW*hour. The agreement about low tariffs on electric power is signed with the Swiss power supply company.

The height of a building allows to install furnaces CZ for loading up to 150 kg for 200 mm diameters ingots.

New bulding for casting machines.

Mai 2007

The second recycling machine for recycling slurry is started. All wire-sawing-machines work with recycling slurry.

New additional recycling slurry machina.

March  2007

Technology news

Swiss wafers has developed new technologies  for slicing wafers with thickness 200 microns.

All productions moving to this technology.

Parameters of quality of wafers were improved. The Yeld of wafers from crystals has increased.

Due to two devices and special  technics of cutting Yeld  of wafers during cutting process has reached to 99 -100 %.

April 2007

The new production hall is fully operating with seven furnaces for the growth of multicrystalline silicon. It offers plenty of free room for further expansion. The construction of the office building is in progress.

November 2006

Swiss Wafers at „ Deutsches Eigenkapitalforum“ in Frankfurt: presentation with a booth and participation in the industry forum „The future role of silicon in the photovoltaic industry – amorphous, microcrystalline and alternative thin film technology as a real alternative?” on 28.11.2006 (11.00) and company presentation in the private company forum „ Renewable Energy – Fuel Cells“ on 29.11.2006 (13.15)

September 2006

Swiss Wafers AG at the 21st European Photovoltaic Solar Energy Exhibition in Dresden, Germany.

August 2006

Construction works on the building expansion start. It will give Swiss Wafers room for several further expansion steps. The expansion includes a large production hall, a new sales office and a R&D center. Immediately after completion, three additional furnaces for the growth of multicrystalline silicon will be installed in the new production hall.

Swiss Wafers starts its fourth furnace for the growth of multicrystalline silicon. The existing production building is now at its limits.

July 2006

Swiss Wafers starts two new wire saws. These are of the latest HCT model with increased power, prepared to cut ultrathin wafers.

June 2006

Swiss Wafers AG at Intersolar, Freiburg, Germany.

April 2006

Talk held by Dr. Lebedev at the 3rd Solar Silicon Conference, Munich:

03-Apr-2006, 15:15 - NEW ENTRANTS «Revival of polysilicon production in countries of the former Soviet Union»

February 2006

The production volume attains 1.5 Mio. square dm per month - this corresponds to 1 Mio. wafers of size 125x125 mm per month.

January 2006

Delivery of Swiss Wafers' third furnace for the growth of multicrystalline silicon. The production capacity for multi ingots is now at 85 tons/year of ready-to-cut blocks 156x156.

December 2005

Delivery of Swiss Wafers' second furnace for the growth of multicrystalline silicon.

Purchase of the neighbouring lot of land (3000 m2) for future expansion. Start of the planning for the building expansion

November 2005

Delivery of a combined squarer / bricketer with wire saw technique.

Now Swiss Wafers covers the complete production chain from polysilicon to solar silicon wafers.

Delivery of Swiss Wafers' third wire saw.

Delivery of a Slurry Recycling Unit for the internal recoverage of used slurry.

August 2005

The production volume attains 750 000 wafers per month.

June 2005

The German company Sunways AG (Konstanz) concludes a long-term cooperation contract .

Swiss Wafers AG on the exhibition Intersolar in Freiburg (Germany)

Discussion about future cooperation with potential partners on the Swiss Wafers booth at the exhibition of the 20th European Photovoltaic Solar Energy Conference in Barcelona (Spain)

May 2005

Startup of the first furnace for the growth of multicrystalline silicon.

March 2005

Visit of MSK's (Japan) president at Swiss Wafers

November 2004

Visit of Motech's (Taiwan) CEO at Swiss Wafers