Slicing Ingots into Wafers

Since the very beginning of Swiss Wafers AG in January 2004, we are slicing silicon ingots into wafers for photovoltaic application using the latest wire saw technology. We execute this operation on wire saws from the two world market leaders HCT and Meyer + Burger, both Swiss companies. Respectively Swiss Wafers has well experienced staff on very complex wire saw process. Also CEO and chief of technology both have many years of experience in wire sawing.

In addition to our own wafer-production via wire sawing we offer also the service of slicing the customer's ingots into wafers.

After slicing the produced wafers pass the ultrasonic cleaning process in an automatic cleaning line. Swiss Wafers uses its own wafer cleaning technique with minimum use of chemicals.

Standard packing:

wafers 125 mm x 125 mm:
100 wafers in Styrofoam box / 1500 wafers in 1 carton box / 18 000 wafers on 1 pallet

wafers 156 mm x 156 mm:
150 wafers in Styrofoam box / 1 800 wafers in 1 carton box / 21 600 wafers on 1 pallet