| Mission
& Vision
Management
Production
& Processes
• Feedstock
Conditioning
• Growing Ingots
• Squaring &
Bricketing Ingots
• Slicing Ingots
to Wafers
Research
& Development
History
Career
Opportunities |
Research & Development
We work continuously on the optimization and automation
of our production processes and on the improvement of the
quality of our products. So we are able to offer our customers
silicon wafers in all common specifications and thicknesses
(180 – 240 mm) with best price conditions. Particularly
in conditioning and preparing raw materials for crystal
growth we have developed methods and procedures to cleaning
inferior raw silicon (top & tails, broken wafer, scrap,
pot scrap etc.). In the current situation of silicon shortage
this know-how advances the competitiveness for us and our
customers.
New technologies: 180 - 200 microns of thickness of Wafers
New technologies: productivity of the furnace of growing is increased up to 340 kg from process, an output of production from the furnace up to 3200 kg/months. Lengths of block increase to 31 cm.
Developments are conducted for the additional coating of crucibles by oxides of rare-earth metals for increase of life time of silicon and heat resistance of crucibles.
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