| Mission
& Vision
Management
Production
& Processes
• Feedstock
Conditioning
• Growing Ingots
• Squaring &
Bricketing Ingots
• Slicing Ingots
to Wafers
Research
& Development
History
Career
Opportunities |
Production & Processes
The production of Swiss Wafers contains all technical
processes leading to silicon wafers:
• silicon ingot growth
• control of ingot properties
• squaring of round ingots
• bricketing of multicrystalline ingots to blocks
• slicing of monocrystalline ingots and multicrystalline
blocks into wafers
• cleaning of wafers from the cutting liquid
• wafer control and packing
Swiss Wafers employs up-to-date technology for these
processes:
• furnaces for multicrystalline ingot growth
• squaring, bricketing machines and wire saws from
the world’s leading wire saw producers
• Recycling of the cutting liquid
• automated ultrasonic wafer cleaning line
More than 40 employees work at Swiss Wafers AG in Weinfelden.
The production is organized in a 4-shift model around the
clock.
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